virdis

10/05/2026 | Redazione Fandis |

From hot spot management to liquid-to-air architectures: how electronic cooling requirements are evolving

The growing power density of electronic devices and the evolution of computing systems are changing the way their cooling systems are designed, profoundly …

08/18/2026 | Redazione Fandis |

ErP 2026 industrial fans: Regulation (EU) 2024/1834

The European Union has taken another step towards environmental sustainability with the publication and entry into force of Regulation (EU) 2024/1834, which …

07/22/2026 | Redazione Fandis |

Withstanding time: why plastic material selection is crucial for outdoor applications

Continuous exposure to UV radiation, humidity and temperature fluctuations can gradually affect the performance of plastic components installed on outdoor …

LATEST SCI-FA ARTICLES

Artificial intelligence in electrical enclosure design

28 August 2026

With the introduction of artificial intelligence into design processes, the question is no longer whether a machine could replace a professional’s experience, but how AI can help them make better decisions. In electrical enclosures, for example [...]

50 Hz vs 60 Hz: what really changes for industrial electrical enclosure components

8 July 2026

When designing or selecting components for electrical enclosures intended for international markets, choosing the right device is only part of the job. The other part is ensuring that these components can operate under the best possible conditions, r [...]

SPS Italia 2026: listening, innovation and new perspectives for electrical enclosure thermal management

4 June 2026

The SPS Italia 2026 edition, one of the most important events for industrial automation, digitalization, and smart manufacturing technologies, has recently come to a close. With more than 37,500 visitors and 720 exhibitors, the exhibition once again [...]